| PART |
Description |
Maker |
| ZTACV-MX ZTTCV-MX |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| TBR-06-197 |
Recommended P.C.B. Layout
|
Major League Electronics
|
| SIM900D |
Layout and Schematic
|
SIM Com
|
| QTH-040-01-F-D-DP-A |
RECOMMENDED PCB LAYOUT
|
Samtec, Inc
|
| AN576 |
PCB LAYOUT OPTIMISATION
|
SGS Thomson Microelectronics
|
| QFP44 |
POD Target Layout
|
iSYSTEM
|
| G8V-1A7T-R |
Micro 280 terminal layout
|
Omron Electronics LLC
|
| USP-10B03 |
Reference Pattern Layout Dimensions
|
Torex Semiconductor
|
| LGA-8B01 |
Reference Pattern Layout Dimensions
|
Torex Semiconductor
|
| RM9W4S-50-ZB |
D-SUB HOUSING MIXED LAYOUT (9W4S)
|
Winchester Electronics ...
|
